| Customer Data(客戶資料) |
| Contact Name(需求人員):
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Title(職稱):
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| Address(地址)
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| Phone(電話):
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Fax(傳真):
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| E-mail Address(電子郵件):
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Cell Phone(大哥大):
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| Requirement(實際需求) |
| Laser(雷射) :
Solid State Laser固態
CO2 & Excimer Laser氣態
Ultra Fast Laser超快
Others |
| Peripherial週邊定位及光學系統:
Stage定位平台
Piezo壓電平台
Optical or goggle鏡片 |
| Measuring Instrument(量測設備) :
Displacement位移
Magnetic/optical 光磁效應
Laser probe |
| Laser Processing雷射加工:
Cutting切割
Engraving雕刻
Drilling鑽孔
Marking標印
Welding焊接 |
| R&D 單純研究用:
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| Technical Information(技術資訊) |
| Part Description 加工材料描述:
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| Industrial or Market Application何種工業或市場應用:
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| Is reference Samples Available 可否提供希望的最終加工結果:
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| Have samples been processed before with lasers ? 曾用其它雷射試過嗎? 結果:
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| Tools/Laser Use for current process 現有加工方式:
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| Cycle Time of current Process 現有加工時效(time/piece):
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| Problem of current process 現製程有何問題:
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| Material(材料) |
| Type of Material 材質:
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| Specification/Dimension規格/尺寸: 加工件尺寸
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| Quantity(min. 5, unless big or expensive) 打樣數量希提供五片
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| MSD sheet or safety data 材料特性表或安全測試
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| Process Requirements(加工程序需求) |
| Machine Type機器型式:
Flying optics馳光
scanner振鏡
X-Y Stage平台
others |
| Laser Wavelength雷射波長:
10.6umIR
1064nmIR
532nmGreen
355nmUV
266nmDUV
Others |
| Required Processing Speed & Cycle time 加工速度及時間:
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| Assistant Gas/Upper exhaust/post process,etc 加工處理吹氣上抽風或後處理:
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| Process Priority
Quality
Cycle time: 加工順序以
品質或
時間為主要考量 |
| Brief Description--(Include quality Criteria such as Linewidth, depth, HAZ, tapering, debris,etc) |
| 簡述品質需求(如切縫寬度, 深度, 熱效應, 鑽孔角度, 雜屑等:
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| Objective of Application Test(測試後的目的) |
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Purchase a stand alone laser購買雷射源 |
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Purcahse a complete Turkey System購買整套雷射系統 |
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Contract Process Development建立合約開發系統 |
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R& D interest研發評估或有興趣 |
| Budget approved預算通過否:
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| Assess Laser as a New Process Tool 評估用雷射當新制程:
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| DTOS Process(客制化產品程序) |
| Special Machine design process : Specification--> Price Analysis--> Contract & 30% Deposit-->Prototype |
| 客制化產品程序: 討論規格--> 報價供成本效益分析--> 簽訂合約及30%預付款-->原型機製作 |
