LCX雷射刀模機

1.雷射功率 : 
200W(RF), 400W(RF),400W (pulse)

2.行程

1500mm(X軸)x1200mm(Y軸)x60mm(z軸)
3.位移速度:12M/min                                         4.定位精度:≤±0.1mm
5.重覆精度:±0.05mm
6.真直度:±0.05mm
7.機台外型:3200mm x 2000mm x 1380mm

LCX Laser Die Board Machine

1. Laser Power:200w/400w(RF), 400w pulse RF
2.Working area: 1500x1200x60mm(X-Y-Z)
3. Positioning Speed: 12M/min
4.Positioning Accuracy : ≤±0.1mm
5.Repeatability : ±0.05mm
6.True Straightness : ±0.05mm                  7.Fixed Beam design, with ball screw & linear way moving structure  

LWH雷射導線去皮機

1. 雷射可CO2 25w,60w RF or DC                 2.十字工作台面積:200 x 100m
3. 最快移動速度 :0.5M/S
3.最高解析度:0.001MM/STEP                         4.重複精度:±0.02MM                                        5.切割線寬:0.2-0.3mm
4.機台外型:1400mm x 400mm x 1200mm

LWH Laser Wire Stripping Machine

1. Laser : CO2 25w,60w RF, 60w DC, 20w fiber laser                                                               2.Moving stripping Area:200 x 100m
3. Max. moving speed :0.5M/S
4.Max. Resolution :0.001MM/STEP                       5.Repeatability:±0.02mm                            6.cutting kerfs width:0.2-0.3mm
7. One laser separate two beam or two laser  design for up/down stripping at the same time                                                        8.processing parameter & time  easy setting to make sure the surface cleanliness 
 

LCJ雷射電子加工應用機

1. 單軸馳光式導光系統, 提升加工品質.       2. 25w/60w/100w雷射光學系統含光束擴大器                                                                      3. 有效加工範圍: 500x500mm以上            4.  X/Y運動機台:滾珠螺桿傳動,                     5. 重覆加工精度,  +/-0.025mm                     6. 線性滑軌, 最高運動速度 15M/min             7. 伺服馬達, 馬達編碼器解晰度: ≤0.001mm

LCJ electronics & BIOS material processing Laser Machine

1. Half fixed beam design to improve the cutting quality.
2. 25w/60w/100w laser power with beam expander  
3. working area : up to 500x500mm
4. X/Y moving stage：ball screw drive

5. Repeatability : +/-0.025mm

6. Linear Way structure : Max. Speed 15M/min

7.AC servo Motor encoder resolution 0.001mm